I-Alumina Ceramic Heater Rod ye-HNB

Inkcazelo emfutshane:

I-Alumina Ceramic Heater Rod ye-HNB
I-ceramic heat element luhlobo lwecandelo lokufudumeza olwenziwa kwi-ceramic material.Iqhele ukusetyenziswa kwizixhobo zokufudumeza ezahlukeneyo, ezinje kwizifudumezi zasemkhathini, ezomisi enwele, iziko lamashishini, kunye nezinye izixhobo zokupheka.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Izinto zokufudumeza zeCeramic zibonelela ngezinto eziluncedo ezininzi

Ubume bobushushu obuphezulu:Izinto zeCeramic ziyakwazi ukumelana nokushisa okuphezulu, okwenza ukuba zilungele izicelo ezifuna ukushisa okukhulu.

Ukufudumeza ngokukhawuleza kunye nokupholisa:Izinto zokufudumeza i-Ceramic zinokufudumeza kwaye zipholile ngokukhawuleza, zivumela ulawulo olufanelekileyo lobushushu.

Ukuqina:Izinto ze-Ceramic ziyaziwa ngokuhlala kwazo kunye nokuchasana nokubola, okwenza izinto zokufudumeza i-ceramic zihlala ixesha elide kwaye zithembekile.

Ukusebenza kakuhle kobushushu:Izinto zokufudumeza i-Ceramic zine-conductivity efanelekileyo ye-thermal, evumela ukuhanjiswa kobushushu ngokufanelekileyo.

Ezi zinto zisoloko zisetyenziswa kwindawo apho kufuneka amaqondo obushushu aphezulu, nalapho ezinye izinto zisenokungafaneleki ngenxa yokumelana nobushushu obuphantsi.Ukusetyenziswa kwezinto zokufudumala kwe-ceramic kuye kwanda kakhulu kumashishini ahlukeneyo ngenxa yokuthembeka kunye nokusebenza.

Uphawu

Ukusebenza:
Ulwakhiwo olumilise okwentonga, ukuqina okuphezulu, akukho lula ukwaphuka.
Ubushushu obuphezulu be-co-firing i-ceramic heat element, ukubumbana okulungileyo, umgca wokushisa ohlanganiswe ngokupheleleyo kwiiseramikhi.
Ukusetyenziswa kwexesha elide lokuthembeka okuphezulu.
Ukufudumeza ngokukhawuleza, ukufana okulungileyo.1000 ℃ iteknoloji yesilivere yokuqhawula kwi-solder joints, i-solder joint stability, ukumelana nobushushu obuphezulu be-350 ℃ ixesha elide.

Ukuchasa:
Ukuchasana nokufudumeza: 0.6-0.9Ω, TCR 1500±200ppm/℃,
Ukufudumala ngokukhawuleza, amandla aphantsi adla.
Ukuxhathisa kweSensor: 11-14.5Ω,TCR 3800±200ppm/℃.

Ulwakhiwo:
Ubungakanani φ2.15 * 19mm, imilo yentloko ibukhali, ncamathelisa
ukugquma ubuso.idayamitha encinci, umphezulu ogudileyo wenza icuba libe lula.flange ngokwayo yenza kube lula ukudibanisa.
I-Lead Soldering imelana nobushushu:≤100℃
amandla okubamba:(≥1kg)

Uvavanyo lweMveliso yoQhathaniso loBubushushu beFlange

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Iimeko zokuvavanya: i-voltage yokusebenza iya kwenza ubushushu bomhlaba wemveliso bufikelele kwi-350 degrees, kwaye emva koko uvavanye ubushushu be-flange emva kwe-30S yokuzinza.

Ukushisa kwe-flange ye-Keycore II (HTCC ZCH) iphantsi xa isebenza.Ubushushu be-flange emva kwemizuzwana ye-30 yokugcina ubushushu be-350 ℃ kumbane osebenzayo we-3.7v ayikho ngaphezu kwe-100 ℃, ngelixa i-Keycore I ijikeleze i-210 ℃ phantsi kweemeko ezifanayo.


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